Skip to main content
English
中文
Log In
Log in
Log in with ORCID
NTU Single Sign On
Have you forgotten your password?
Home
.National Taiwan University / 國立臺灣大學
Project / 研究計畫
高精密度與高解析度檢測技術平台應用於先進半導體3D封裝
高精密度與高解析度檢測技術平台應用於先進半導體3D封裝
Details
Primary Data
Project title
High-precision and high-resolution measurement techniques for advanced semiconductor 3D package
Internal ID
113L8518
Principal Investigator
劉建豪
Start Date
July 1, 2024
End Date
December 31, 2024
Organizations
機械工程學系
Partner Organizations
教育部高等教育深耕計畫