Project title
添加微量Fe、Co、Ni至無鉛銲料對界面生成物Cu3Sn厚度之影響
Internal ID
NSC94-2622-E-002-029-CC3
Principal Investigator
Start Date
November 1, 2005
End Date
October 31, 2006
Partner Organizations
添加微量Fe、Co、Ni至無鉛銲料對界面生成物Cu3Sn厚度之影響
Keywords
無鉛銲料
SnAgCu
Cu6Sn5
Cu3Sn
Kirkendall's voids
drop test
Lead-free solder
SnAgCu
Cu6Sn5
Cu3Sn
Kirkendall's voids
drop test