Project title
以一種新技術來探討電遷移現象之基礎研究(3/3)
Internal ID
NSC94-2216-E-002-038
Principal Investigator
Start Date
August 1, 2005
End Date
October 31, 2006
Partner Organizations
以一種新技術來探討電遷移現象之基礎研究(3/3)
Keywords
電遷移現象
current crowding
覆晶
銲料
Electromigration
Current Crowding
Flip-Chip
Solders