Project title
功能性晶圓機械化學精密研磨研究(2/2)
Internal ID
104-2622-E-002-007-CC2
Principal Investigator
Start Date
February 1, 2015
End Date
January 31, 2016
Partner Organizations
功能性晶圓機械化學精密研磨研究(2/2)
Keywords
三維堆疊式積體電路
功能性晶圓
晶圓薄化
雷射微鑽孔
化學機械拋光
3DS-IC
Functional wafer
Wafer thinning
Laser via
CMP