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Home
.National Taiwan University / 國立臺灣大學
Project / 研究計畫
半導體製程及封裝熱變形及翹曲全域量測和瑕疵檢測技術開發
半導體製程及封裝熱變形及翹曲全域量測和瑕疵檢測技術開發
Details
Primary Data
Internal ID
113L894101
Principal Investigator
鄭憶中
Start Date
January 1, 2024
End Date
December 31, 2024
Organizations
機械工程學系
Partner Organizations
教育部高等教育深耕計畫
Description
Keywords
semiconductor
package
thermal warping
3D stacking
high-aspect-ratio
