Project title
臺美半導體合作計畫-應用於人工智慧與機器學習之即時可重組陣列架構技術
Internal ID
112-2923-E-002-014-MY3
Principal Investigator
Start Date
July 1, 2023
End Date
June 30, 2024
Organizations
Partner Organizations
臺美半導體合作計畫-應用於人工智慧與機器學習之即時可重組陣列架構技術
Keywords
可重組陣列;動態多程序排程;異質系統整合;高能效硬體加速;人工智慧與機器學習應用;Reconfigurable array; dynamic multi-program scheduling; heterogeneous system integration; energy-efficient hardware acceleration; AI/ML applications