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.National Taiwan University / 國立臺灣大學
Project / 研究計畫
晶圓矽導微孔技術(TSV)應用於3D封裝基板之研究
晶圓矽導微孔技術(TSV)應用於3D封裝基板之研究
Details
Primary Data
Project title
晶圓矽導微孔技術(TSV)應用於3D封裝基板之研究
Internal ID
100-2221-E-002-053-
Principal Investigator
HONG-TSU YOUNG
Start Date
August 1, 2011
End Date
July 31, 2012
Partner Organizations
National Science and Technology Council