物質跨越微電子銲點進行交互作用之尖端研究(2/3)

Project title

Internal ID

NSC 95-2221-E-002 -443 -MY3

Principal Investigator

Start Date

August 1, 2007

End Date

July 31, 2008

Partner Organizations

Keywords

無鉛銲料

球矩陣封裝

覆晶封裝

交互作用

錫銀銅銲料

Lead-Free Solders

Ball Grid Array Package

Flip-Chip Package

Cross-Interaction

SnAgCu solders

物質跨越微電子銲點進&#64008;交互作用之尖端研究(2/3)