Project title
電遷移對覆晶元件銲點之影響(2/3)
Internal ID
NSC95-2221-E-002-441
Principal Investigator
Start Date
August 1, 2006
End Date
July 31, 2007
Partner Organizations
電遷移對覆晶元件銲點之影響(2/3)
Keywords
電遷移
覆晶
current crowding
銲點
Electromigration
Flip-Chip
Current Crowding
Solder Joint