以燒結銀銦為接合技術之高溫高功率電力晶片封裝技術開發

Project title

以燒結銀銦為接合技術之高溫高功率電力晶片封裝技術開發

Internal ID

107-2221-E-002-018-MY3

Principal Investigator

Start Date

August 1, 2018

End Date

July 31, 2019

Partner Organizations

National Science and Technology Council