Project title
總計畫：探索尖端材料在微奈米尺度下之新穎機械行為-子計畫四：三維晶片新穎高強度微奈米接點之研發
Internal ID
10R80920-04
Principal Investigator
Start Date
August 1, 2011
End Date
July 31, 2012
Partner Organizations
總計畫：探索尖端材料在微奈米尺度下之新穎機械行為-子計畫四：三維晶片新穎高強度微奈米接點之研發
Keywords
三維積體電路
晶片對接
銲料
穿晶通孔
界面反應
three-dimensional integrated circuit
chip-to-chip bonding
solder
through silicon vias
interfacial reactions