Intermetallic Compounds Formed during the Reflow of In-49Sn Solder Ball-Grid-Array Packages

Resource

Journal of Electronic Materials 32 (3): 195-200

Journal

Journal of Electronic Materials

Journal Volume

32

Journal Issue

3

Pages

195-200

Date Issued

2003

Date

2003

Author(s)

Chuang, T. H.

Chang, S. Y.

Tsao, L. C.

Weng, W. P.

Wu, H. M.

URI

Type

journal article

File(s)

Name

81.pdf

Size

648.55 KB

Format

Adobe PDF

Checksum

(MD5):121a4832afabbf2051da18fd8251e3e9