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  4. Microstructure Simulation of Martensitic Thin Film/Substrate Accounting for the out-of-plane Inhomogeneity
 
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Microstructure Simulation of Martensitic Thin Film/Substrate Accounting for the out-of-plane Inhomogeneity

Date Issued
2009
Date
2009
Author(s)
Lin, Sheng-Wang
URI
http://ntur.lib.ntu.edu.tw//handle/246246/183558
Abstract
Martensitic materials play an important role of smart materials because of shape memory effect, and they are applied extensively to produce sensors and actuators. The microstructures make those materials have special property and the regular arrangement and evolution of microstructures can induce significant nonlinear behaviors. Therefore, it’s an important topic to use the materials in a right way, to analyze and simulate the microstructure and to get the relationship between external stimuli, microstructure and nonlinear behaviors. We develop a novel phase-field model to describe 2-D Martensitic film system and film with substrate system base on the theory our group developed in the past so that we could operate microstructure simulation and govern the formation and evolution.n the article, each case we get the evolution equation by energy limited method and construct the fast mathematical calculations to calculate the stress field in the materials by Fourier transform. Film system, we first confirm the credibility of the mathematical calculations to calculate the stress field. Second, we prove the credibility of the assumption our group make to the out-of-plane inhomogeneity. Finally, we change the parameters systematically to observe and analyze the microstructure patterns. Film with substrate system, we repeat the first step and final step in film system, and we also get many satisfied results which are consistent to experiments. In the future, those results will offer much helpful information and idea to researchers who operate analogous simulations or experiments.
Subjects
Martensitic Material
Fast Fourier Transform
Novel Phase-Field Method
Microstructure
Type
thesis
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ntu-98-R96543039-1.pdf

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