Full wave characterization of a through hole via discontinuity in multi-layered packaging

Journal

3rd Topical Meeting on Electrical Performance of Electronic Packaging

Pages

219-222

Date Issued

1994

Author(s)

Hsu, Show-Gwo

DOI

10.1109/epep.1994.594151

URI

http://scholars.lib.ntu.edu.tw/handle/123456789/310442

http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041910032404/1/00594151.pdf

Type

conference paper

File(s)

Name

00594151.pdf

Size

282.51 KB

Format

Adobe PDF

Checksum

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