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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB)
Details
Coupling effect of ground bounce noise for ball grid array (BGA) package mounted on printed circuit boards (PCB)
Journal
Taiwan Electromagn. Compat. Conf.
Pages
64-68
Date Issued
2003-10
Author(s)
S.-T. Chen
C.-W. Tsai
S.-M. Wu
C.-P. Hung
TZONG-LIN WU
URI
http://scholars.lib.ntu.edu.tw/handle/123456789/304260
Type
conference paper