無鉛銲錫球格陣列構裝製程與可靠度分析─總計畫(II)
Date Issued
2002
Date
2002
Author(s)
DOI
902216E002031
Abstract
Ball grid array(BGA) packaging is
nowadays the most worldwide packaging
technique because of the high packaging
density, good heat dissipation, self
alignment, and high yield. This research is
investigated the lead-free solders about
the reliability test of the solder ball.
Results of ball shear test showed that
the strength was corresponded to the
microstructure of the solder. In the other
hand, god embrittlement took place at the
(Au,Ni)Sn4 interface at tin-lead joints,
which led to a brittle and weak joint. And
the lead-free solder also have the god
embrittlement in the joint and affect the
reliability of the packaging.
Publisher
臺北市：國立臺灣大學材料科學與工程學研究所
Type
report
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