Chemical Mechanical Polishing of Copper - Plated Wafer and Its Electrochemical Characteristics

Date Issued

2001-10-05

Date

2001-10-05

Author(s)

DOI

892214E002056

URI

Subjects

chemical mechanical polishing(CMP)

electrochemical method

copper metallization process

Publisher

臺北市：國立臺灣大學化學工程學系暨研究所

Type

report

File(s)

Name

892214E002056.pdf

Size

315.1 KB

Format

Adobe PDF

Checksum

(MD5):d8e50198f7cea4e013acc835ca23bfe2