The Performance Investigation of Bubble Pump in Cooling System
Date Issued
2009
Date
2009
Author(s)
Yuan, Pei-Yun
Abstract
With the growth of electronic industry, electronic components become more powerful but the size of them tends to be smaller. It induces the challenge in thermal solution, and several kinds of electronic cooling methods are applied to conquer the thermal dissipation problem. In recent years, the applications of boiling-condensation heat transfer mechanism are widely used for the heat dissipation problem. Besides, the most common cooling method for electronic components like closed loop water-cooling system has to be driven by a pump. The present study is to design a bubble pump combining the ideas of taking away the heat using the latent heat of the working fluid and driving the system with bubbles formed through boiling. This paper establishes a set of experimental methods for the performance of the bubble pump. The influences of the different plate surfaces, heating power, inlet temperature to the performance of bubble pump are under evaluation. The boiling phenomenon is observed through the transparent cover of the chamber, and the result shows that the bubble pump has three states: (a) nature convection (b) subcooled boiling (c) saturated boiling. The results of the heater temperature, mass flow rate and convection heat transfer coefficient are discussed in each state, and they all increase to certain extent when the heating power increased except the maximum value of mass flow rate is found in the saturated boiling area. It is shown that the maximum mass flow rate is 149 g/min while using the plate with cavities in square array and the heating power is 30W. The mathematical model and the experimental results are integrated to generate the performance curve of the bubble pump.
Subjects
bubble pump
cooling system
performance of bubble pump
visualization experiment
pump curve
Type
thesis
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