A novel micro-scale recombining technique using lateral joining for a large-area molding with small features
Resource
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
Journal
IEEE The Sixteenth Annual International Conference on Micro Electro Mechanical Systems
Pages
-
Date Issued
2003-01
Date
2003-01
Author(s)
DOI
1084-6999
Abstract
A novel micro-scale recombining technique using a lateral joining of silicon crystal planes is first presented. The new concept of the technique is realized by fabricating a large silicon molding plate beyond a wafer size with small features. The replication of the joint plate using the hot embossing technique has been characterized in surface profiles, pictures, and optical performance. Both experiment and simulation results reached good agreement in diffractive optical intensity. Furthermore, the scalability of the technique was extensively demonstrated with three silicon wafers. As a result, the novel technique provides a potentially low-cost approach to fill the technology gap between the conventional precision machining and photolithography-based micromachining for a beyond-wafer-size silicon plate with small features.
Description
Kyoto
Type
other
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