A novel micro-scale recombining technique using lateral joining for a large-area molding with small features

Resource

Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on

Journal

IEEE The Sixteenth Annual International Conference on Micro Electro Mechanical Systems

Pages

-

Date Issued

2003-01

Date

2003-01

Author(s)

Wu, Chih-Wei

Huang, Long-Sun

Chang, Jer-Haur

DOI

DOI

1084-6999

URI

Description

Kyoto

Type

other

File(s)

Name

01189826.pdf

Size

299.18 KB

Format

Adobe PDF

Checksum

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