Analysis of Thick Plates Using SCM Method
Date Issued
2009
Date
2009
Author(s)
Chen, Hsuan-Wen
Abstract
The interest of engineers in numerical methods has grown exponentially in the last decades. High-capacity personal computers are now mass produced and are available for a very reasonable price. SCM is one of numerical methods which had been applied in several engineering problem ,and be proved that SCM yields sufficiently accurate result and SCM is fast. In thin plate problem, SCM also provides reliable analyses. However, for the plate with thickness-to-span ratio h/L bigger than 0.1, Kirchhoff and Love’s classical plate theory’s accuracy decrease with growing thickness of the plate. There is an inherent limitation of classical plate theory due to the neglect of the effect of transverse shear strain, since it is assumed the normal to the middle plane remain normal to the deflected middle plane. It’s necessary to refined theories by introducing the effect of transverse shear strains in order to obtain reliable result for the behavior of the thick plate. Developing a refined two-dimensional equation which has more reliable result than classical theory and not so complex like three-dimensional equation interesting engineers. REISSNER and MINDLIN all formulate their thick plate equations by using three variables w(transverse deflection),ψx(rotation of the normals to the middle surface along X axis)、ψy(rotation of the normals to the middle surface along X axis.) In this paper, we apply SCM in thick plate with three governing equation analysis by using redefined overlap collocation. By using MATLAB, we have several case with different thickness-to-span ratio, and proved that SCM has economical and reliable result of thick plate analyses.
Subjects
Thick plate
numerical method
collocation
Type
thesis
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