Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads

Resource

Journal of Materials Engineering and Performance, In Press

Journal

Journal of Materials Engineering and Performance, In Press

Pages

-

Date Issued

2008

Date

2008

Author(s)

Jain, C.C.

Wang, S.S.

Huang, K.W.

Chuang, T.H.

URI

Type

journal article

File(s)

Name

111.pdf

Size

593.98 KB

Format

Adobe PDF

Checksum

(MD5):e03483ace848b00575db86832e78d65d