A new integration of device-scale micropackaging with bi-directional tunable capacitors

Resource

Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on

Journal

Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on

Pages

-

Date Issued

2003-01

Date

2003-01

Author(s)

Chu, Chia-Hua

Huang, Long-Sun

Chen, Jen-Yi

Lee, I-Lien

Chang, Peizen

DOI

DOI

1084-6999

URI

Type

other

File(s)

Name

01189834.pdf

Size

294.28 KB

Format

Adobe PDF

Checksum

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