Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints
Resource
Journal of electronic materials, 39(8), 1289-1294
Journal
Journal of electronic materials
Journal Volume
39
Journal Issue
8
Pages
1289-1294
Date Issued
2010
Date
2010
Author(s)
Abstract
Interdiffusion and interfacial reaction of 95Pb-5Sn solder bumps and 37Pb-63Sn presolder in flip-chip solder joints during high-temperature storage were studied. Reaction temperatures included 100°C, 130°C, 150°C, and 175°C. It was found that Cu 6Sn 5 and Cu 3Sn formed on the board side and (Ni,Cu) 3Sn 4 formed on the chip side after 100 h of aging. After 2000 h of aging at 175°C, the Ni under-bump metallization (UBM) was exhausted. This caused the (Ni,Cu) 3Sn 4 layer at the chip-side interface to be gradually converted into (Cu 0.6Ni 0.4) 6Sn 5. It was also found that the consumption of the Ni UBM was faster than the case where eutectic Sn-Pb solder was used for the entire joint. Nevertheless, the consumption of the Cu on the substrate side was slower than the case where pure eutectic Sn-Pb solder was used for the entire joint. © 2010 TMS.
Type
journal article
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