Hybrid routing on multichip modules
Journal
Custom Integrated Circuits Conference
Pages
28.4.1-28.4.4
Date Issued
1991
Author(s)
Abstract
A hybrid routing approach for multichip modules (MCMs) is proposed. The routing implementation is divided into three stages: signal-net routing, I/O-pad interconnection, and power/ground layout. A special feature of the implementation is that, in the second stage, some interconnected segments are allowed to be tilted with a slope for reducing the MCM layout area. Experimental results on MCM examples indicate that the performance of the hybrid routing is very encouraging.>
Type
conference paper
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