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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Hot embossing of microstructure with moving induction heating and gas-assisted pressuring
Details
Hot embossing of microstructure with moving induction heating and gas-assisted pressuring
Journal
Microsystem Technologies
Journal Volume
26
Journal Issue
3
Pages
957-967
Date Issued
2020
Author(s)
Kao, C.-C.
Ke, K.-C.
Hung, W.-C.
SEN-YEU YANG
DOI
10.1007/s00542-019-04560-7
URI
https://www.scopus.com/inward/record.url?eid=2-s2.0-85070308487&partnerID=40&md5=38c18efefd9885dcd65b302745a40976
https://scholars.lib.ntu.edu.tw/handle/123456789/547508
SDGs
[SDGs]SDG3
[SDGs]SDG7
[SDGs]SDG9
Type
journal article