Resistance computations for multilayer packaging structures by applying the boundary element method
Journal
IEEE Transactions on Components, Hybrids, and Manufacturing Technologies
Journal Volume
15
Journal Issue
1
Pages
87-96
Date Issued
1992-02
Author(s)
Abstract
A boundary element formulation together with the moment method analysis is proposed to find the equivalent multiport DC resistances for packaging structures consisting of uniform conducting plates with arbitrarily shaped boundaries. Incorporated with a new equiangle division scheme and exact integration formulas, this approach is very efficient in the use of computer storage and computation time, allowing many practical structures to be dealt with even by a small personal computer. The method is employed to investigate the effect on the equivalent resistances due to the presence of the interior apertures and the exterior boundary. Also presented are the resistance modeling technique for the multilayer packaging structures and a novel cut and fill technique to estimate the resistances of complicated structures.>
Type
journal article