Study of self-assembly technology for 3D integration applications
Journal
2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings
Pages
237-240
ISBN
9.78147E+12
Date Issued
2015
Author(s)
Chang H.-C.; Fan C.-H.; Chou Y.-C.; Chen K.-N.
Abstract
In this paper, the self-assembly technology is investigated in order to apply on the alignment method to achieve rapid and accurate multichip-to-wafer stacking. By virtue of distinct liquid surface tensions between hydrophilic and hydrophobic materials, the hydrophilic chips can be self-aligned to the hydrophilic substrate which is defined by the surrounding hydrophobic substrate. The surface quality of hydrophobic film with self-assembled monolayers (SAMs) based on self-assembled mechanism strongly affects the performance of alignment. The surface quality of SAMs film which depends on experimental parameters such as dip-coating time and heating time is critical to determine the accuracy of alignment. Moreover, the chip shape and size also have an impact on the alignment accuracy. By improving the misalignment, a good design by the self-assembled mechanism for the self-alignment method can be applied in the bonding technology. © 2015 IEEE.
Subjects
Alignment; Chip scale packages; Hydrophilicity; Hydrophobicity; Microsystems; Reconfigurable hardware; Self assembly; Surface properties; Three dimensional integrated circuits; Alignment accuracy; Chip shape and size; Experimental parameters; Hydrophilic and hydrophobic; Hydrophilic substrate; Hydrophobic substrate; Liquid surface tension; Self-assembly technology; Self assembled monolayers
Publisher
Institute of Electrical and Electronics Engineers Inc.
Type
conference paper