Full Wave Characterization of a Through Hole Via Discontinuity in Multi- Layered Packaging
Journal
1994 IEEE Electrical Performance of Electronic Packaging
Pages
219-222
Date Issued
1994
Author(s)
Hsu, Show-Gwo
Abstract
The frequency dependent propagation characteristics of a via penetrating through a hole in a ground plane in multi-layered packaging were investigated by a full wave numerical approach.
Type
conference paper