Fabrication of Conductive Metal Tracks and Thin Film Patterns for Microelectronic Devices with Printing Technology
Date Issued
2013
Date
2013
Author(s)
Kao, Zhen-Kai
Abstract
With computer assistance, inkjet printing can accurately print ink onto specific locations and produces various unique components. Therefore, inkjet printing technology possesses the characteristics of material savings and cost reduction, and does not require contact or mold opening. Furthermore, inkjet printing technology can be applied to flexible substrates and potentially can be employed in the electronics industry. In this study, an inkjet printing technique was used to deposit various nanoparticle or chemical reactive inks onto plastic substrates. This study comprises of four major aspects: preparing various functional inks, producing conductive thin films under low temperatures, rapidly printing thin film patterns, manufacturing electronic components.
The history and applications of inkjet printing technology will be generally introduced in Chapter 1, and the principal theories and relative literatures will be discussed as well. Chapter 2 introduces physical or chemical synthetic methods for the preparation of stable nanoparticle and polymer inks. Printing tests and material characteristic analysis were conducted to further optimize nanoparticle deposition on substrate surfaces.
In Chapter 3, a new method is described for conductive silver film formation. An inkjet printing device with two ink channels was used to deposit silver thin films. Two inks, silver ammonia and PVP/formaldehyde solutions, were separately ejected, mixed, and reacted on the substrates. The electrical conductivity of the resulting silver lines is 10% of bulk silver at room temperature. After sintered at 100 °C for an hour, electrical conductivity can be enhanced to 23%.
In addition, a simple and efficient method is developed to create conductive copper thin films on polymer surfaces in Chapter 4. Micropatterns of silver nitrate inks, which serve as an activating agent for copper plating, were printed and dried on flexible plastic substrates. The printed plastic sheets were then immersed in an electroless copper plating bath to create copper thin films on the printed patterns. The prepared copper films have an electrical conductivity as high as 83% of bulk copper and show good adhesion on flexible substrates.
In Chapter 5, we used the PEDOT:PSS ink, TiO2 ink and silver nanoparticle ink to fabricate microelectric devices, such as taxel device and RRAM device. The devices were created and showed excellent performance. Those results indicate the feasibility and great potential of applying inkjet printing technology on flexible electronic devices.
Subjects
噴墨印刷技術
墨水
可撓曲基板
無電鍍
電子元件
Type
thesis
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