Interfacial reactions in thermoelectric modules
Journal
Materials Research Letters
Journal Volume
6
Journal Issue
4
Start Page
244
End Page
248
ISSN
21663831
Date Issued
2018
Author(s)
Abstract
Engineering transport properties of thermoelectric (TE) materials leads to incessantly breakthroughs in the zT values. Nevertheless, modular design holds a key factor to advance the TE technology. Herein, we discuss the structures of TE module and illustrate the inter-diffusions across the interface of constituent layers. For Bi2Te3-based module, soldering is the primary bonding method, giving rise to the investigations on the selections of solder, diffusion barrier layer and electrode. For midtemperature PbTe-based TE module, hot-pressing or spark plasma sintering are alternative bonding approaches; the inter-diffusions between the diffusion barrier layer, electrode and TE substrate are addressed as well. (Figure presented). © 2018 The Author(s).
Subjects
Bi2 Te3
Interfacial reaction
PbTe
Thermoelectric (TE) material and module
Publisher
Taylor and Francis Ltd.
Type
journal article