Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

1

Pages

165-169

Date Issued

2006

Author(s)

Wang, S.S.

Tseng, Y.H.

TUNG-HAN CHUANG

DOI

10.1007/s11664-006-0199-5

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492014

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-32644438301&doi=10.1007%2fs11664-006-0199-5&partnerID=40&md5=1c97dd880bf8c109a2ee58d57d09c5c8

Type

journal article