固液擴散接合法製作電子構裝耐溫微接點研究(Ⅲ)─子計畫一:固液擴散接合耐溫微接點界面反應研究(Ⅲ)
Date Issued
2000
Date
2000
Author(s)
DOI
892216E002029
Abstract
Solid-liquid interdiffusion bonding (SLID)
is an advanced technique for the microjoints
of electronic packaging. This technique used
a low melting metallic thin-film interlayer,
which melts at low temperatures and rapidly
reacts with the metallized layer of electron
package to form high melting intermetallic
compounds, thus achieving the special
features of bonding at low temperatures and
use at high temperatures. The efforts of this
subprogram focus on the interfacial reaction
mechanisms and kinetics during the SLID
process. The report involves the results in
Cu/Sn , Cu/In , Ni/Sn , Ni/In , Au/Sn , Au/In ,
Au-InSn and Ni/Bi systems.
Subjects
Solid-liquid interdiffusion bonding
soldering reactions
thin-film reactions
Publisher
臺北市：國立臺灣大學材料科學與工程學研究所
Type
report
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Name
892216E002029.pdf
Size
1.31 MB
Format
Adobe PDF
Checksum
(MD5):af3a5cffb878a5194991d9a515f8c2dc