Inhibiting the formation of (Au1-xNix)Sn4 and reducing the consumption of Ni metallization in solder joints
Resource
Journal of Electronic Materials,31(11),1264-1269.
Journal
Journal of Electronic Materials
Journal Volume
31
Journal Issue
11
Pages
1264-1269
Date Issued
2002-11
Date
2002-11
Author(s)
Ho, C. E.
Shiau, L. C.
Kao, and C. R.
Type
journal article