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College of Engineering / 工學院
Chemical Engineering / 化學工程學系
Time-varying wetting behavior on copper wafer treated by wet-etching
Details
Time-varying wetting behavior on copper wafer treated by wet-etching
Journal
Applied Surface Science
Journal Volume
341
Pages
37-42
Date Issued
2015
Author(s)
Tu, S.-H.
Wu, C.-C.
Wu, H.-C.
Cheng, S.-L.
Sheng, Y.-J.
Tsao, H.-K.
YU-JANE SHENG
DOI
10.1016/j.apsusc.2015.01.048
URI
http://www.scopus.com/inward/record.url?eid=2-s2.0-84926391950&partnerID=MN8TOARS
http://scholars.lib.ntu.edu.tw/handle/123456789/391426
Type
journal article