Experimental investigation of vapor chamber
Journal
Proceedings - 2007 International Symposium on Microelectronics, IMAPS 2007
Pages
984-991
Date Issued
2007
Author(s)
Abstract
The present work experimentally investigates the thermal performance of the vapor chamber module. Vapor chamber utilizes boiling-condensation mechanism to achieve high heat transfer capability and heat spreading performance. The experimental parameters are heating power, fill-ratio of working fluid, and size of heating area. In the results, the device performs better at high heating power. The best fill-ratio for the vapor chamber is 30%, with which the vapor chamber resistance reaches the best performance of 0.1°C/W at 180W. A smaller heating area leads to a worse vapor chamber resistance. Besides, this study also compares the thermal performances between vapor chamber and an equal-sized copper plate. The results show that the heat transfer capability and heating spreading performance of the vapor chamber are all better than those of the copper plate.
Subjects
Boiling-condensation; Fill-ratio; Thermal performance; Vapor chamber
Other Subjects
Boiling-condensation; Experimental investigations; Experimental parameters; Fill-ratio; Heat transfer capability; High heat transfers; Thermal Performance; Vapor chamber; Condensation; Copper; Heating; Microelectronics; Mixed convection; Vapors
Type
conference paper