Surface Diffusion and the Interfacial Reaction in Cu/Sn/Ni Micro-Pillars

Journal

Journal of Electronic Materials

Date Issued

2020

Author(s)

Yu H.Y.

Yang T.H.

Chiu Y.S.

DOI

10.1007/s11664-019-07455-5

URI

https://www.scopus.com/inward/record.uri?eid=2-s2.0-85069956945&doi=10.1007%2fs11664-019-07455-5&partnerID=40&md5=b0cbffcfe8751d89bc5ab39080d89ffd

https://scholars.lib.ntu.edu.tw/handle/123456789/432572

Publisher

Springer New York LLC

Type

journal article