陶瓷低溫活性軟銲接合之反應機理研究
Date Issued
2004
Date
2004
Author(s)
DOI
922216E002023
Abstract
The objectives of this project are to
conduct an in-depth investigation of the
reaction mechanism responsible for the
joining of various ceramics using a low
temperature active solder added with
rare earth elements. The bonding
experimental materials involved various
ceramics, such as alumina, zirconia and
ZnS. The joining of some difficultly
wettable materials was added in this
study, such as graphite, glass, Ti, and
foam Al. The interfacial microstructure
as well as the reaction products after bonding will be analyzed, and their bonding strengths measured.
Subjects
ceramic bonding
low temperature active soldering
fillers
rare-earth elements
reaction mechanism
Publisher
臺北市：國立臺灣大學材料科學與工程學研究所
Type
report
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