Multivariable control of multi-zone chemical mechanical polishing
Resource
Semiconductor Manufacturing Technology Workshop Proceedings, 2004
Journal
Semiconductor Manufacturing Technology Workshop Proceedings
Pages
-
Date Issued
2004
Date
2004
Author(s)
Shiu, Sheng-Jyh
Yu, Cheng-Ching
Shen, Shih-Haur
Su, An-Jhih
DOI
N/A
Abstract
The modeling and multivariable control of the multi-zone CMP are studied in this work. In the process control notation, the manipulated variables are the three pressures applied to each zone. Therefore, this is a 60/spl times/3 non-square multivariable control problem. The singular value decomposition (SVD) is used to design a non-square feedback controller. The proposed control system is test on incoming wafers with different surface profiles. Results show that achievable performance can be maintained using the proposed SVD controller.
Type
journal article
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