Investigation and Analysis of the Capillary Heat Plate
Date Issued
2005
Date
2005
Author(s)
Chiu, Chih-Kai
DOI
zh-TW
Abstract
In recent decades, performance of the chip and speed of operation are improving constantly, there is the problem of the hotspot produced by the non-uniform density of heat source newly besides the tradition problem of the total power have increased. The boiling mechanism appears within the capillary heat plate while operating, at the same time it can dissipate heat rapidly and also spread heat evenly to get the result of uniform temperature within the design of vapor chamber. In the paper there is a set of detailed experiment methods for investigation and analysis of the capillary heat plate. Study the influence on performance of the heating rate, fill ratio, angle of inclination, and heater area and set up theory models in order to offer the analysis and improvement of the capillary heat plate in the future. The experimental result shows that the thermal resistance will drop with increasing of heating rate and the best filling amount is 3.31cc, accounts for 30% of the total volume of the container. When the fill ratio is too low, the system inside will burn out. If the fill ratio is higher, the system performance will become bad. As the capillary heat plate is put vertical or upside down, it can still work normally. The heat-conduction coefficient of the capillary heat plate is superior to copper. The spreading resistance of the capillary heat plate is lower by about 35% than copper. When the fill ratio is 30% and the heating rate is 180W, the performance of the capillary heat plate will be best and compare with copper, the total resistance is lower about 20%.
Subjects
毛細熱板
蒸氣腔體
擴散熱阻
Capillary Heat Plate
Vapor Chamber
Spreading Resistance
Type
thesis
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