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  4. Design of SIW-Fed End-fire Exponential Tapered Horn Antenna for sub-THz Communications
 
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Design of SIW-Fed End-fire Exponential Tapered Horn Antenna for sub-THz Communications

Journal
2024 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition (iWEM)
Part Of
IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition, iWEM 2024
Journal Volume
25
Start Page
1
End Page
2
ISBN (of the container)
979-835036697-6
Date Issued
2024-07-10
Author(s)
Prabir Garu
Zhao-Hong Tu
Yu-Hsiang Cheng  
DOI
10.1109/iwem59914.2024.10649125
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/722155
Abstract
High gain and broadband antennas are crucial to meet the demand for efficient high-speed communication in sub-terahertz (Sub-THz) frequencies. Achieving both simultaneously istypically challenging for planar antennas in this frequency band. This letter proposes a low-profile substrate integrated waveguide (SIW) fed end-fire exponential tapered horn antenna (ETHA) designed and analyzed for sub-THz communications. To mitigate the impedance mismatch caused by the thin substrate (0.254 λ0), a semi-open SIW horn is designed by exponentiallydetaching one broadwall in the flare part while retaining the other. Additionally, to improve the radiation performances, a dielectric slab is added to the aperture of the horn to facilitate a smooth transition to free space. The antenna element operates within the frequency band from 220- 328.68 GHz, providing a -10 dB fractional impedance bandwidth of 39.6% centered at 274 GHz. With stable endfire radiation patterns, the antenna achieves a peak realized gain of 15.5 dBi at the center frequency with 3 dB beamwidth of 11.6o in the H-plane and 18.1o in the E-plane. These outcomes make this antenna highly promising for operation within channel 69, as defined by the IEEE 802.15.3d standard.
Event(s)
2024 IEEE International Workshop on Electromagnetics: Applications and Student Innovation Competition, iWEM 2024
SDGs

[SDGs]SDG7

Publisher
IEEE
Type
conference paper

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