Intermetallic reactions in Sn-8Zn-20In solder ball grid array packages with Au/Ni/Cu and Ag/Cu pads

Resource

Journal of Electronic Materials 35 (1): 147-153

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

1

Pages

147-153

Date Issued

2006

Date

2006

Author(s)

Liu, Yu-Chih

Lin, Wei-Hong

Lin, Hsiu-Jen

URI

Type

journal article

File(s)

Name

92.pdf

Size

515.93 KB

Format

Adobe PDF

Checksum

(MD5):b6db645ecd53762d08ab6670b8c07c34