Microstructure evolution and hardening mechanisms of Ni-P electrodeposits

Resource

Surface and Coatings Technology, 205(7), 2097-2103

Journal

Surface and Coatings Technology

Journal Volume

205

Journal Issue

7

Pages

2097-2103

Date Issued

2010

Date

2010

Author(s)

Huang, Hsien-Chung

Chung, Sung-Ting

Pan, Szu-Jung

Tsai, Wen-Ta

DOI

URI

Type

journal article

File(s)

Name

261.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

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