Novel RDL design of wafer-level packaging for signal/power integrity in LPDDR4 application

Journal

IEEE Transactions on Components, Packaging, and Manufacturing Technology

Journal Volume

8

Journal Issue

8

Pages

1675-1686

Date Issued

2018

Author(s)

K.-B. Wu

T.-Y. Kuo

B. Hung

B. Lin

C. Peng

M.-T. Yang

R.-B. Wu

DOI

10.1109/tcpmt.2018.2850528

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/427878

Type

journal article