Effects of Ce and La Additions on the Microstructure and Mechanical Properties of Sn-9Zn Solder Joints

Resource

Journal of Electronic Materials, 39(2), 200-208

Journal

Journal of Electronic Materials

Pages

200-208

Date Issued

2010

Date

2010

Author(s)

Lin, Hsiu-Jen

DOI

URI

Type

journal article

File(s)

Name

379.pdf

Size

23.45 KB

Format

Adobe PDF

Checksum

(MD5):35bda7e17238ba24d9335c49749502ba