Data Mining for Delamination Diagnosis in the Semiconductor Assembly Process
Journal
Procedia Manufacturing
Journal Volume
11
Pages
1976-1983
Date Issued
2017
Author(s)
Abstract
The delamination in die-attach layer is a problem that results in defects of semiconductor products. There are several elements and parameters, which are difficultly observed, causing delamination during the assembly process. Thus, it's critical to identify abnormal factors immediately for the real-time correction and improvement. This paper proposes a two-stage analysis framework to achieve two goals: identifying the key factors affecting delamination via variable selection and predicting the ratio of the delamination area in a die via the prediction models.
Type
journal article