Area-I/O flip-chip routing for chip-package co-design

Journal

IEEE/ACM International Conference on Computer-Aided Design

Pages

518-522

Date Issued

2008

Author(s)

Fang, J.-W.

DOI

10.1109/ICCAD.2008.4681624

URI

http://www.scopus.com/inward/record.url?eid=2-s2.0-57849154836&partnerID=MN8TOARS

http://scholars.lib.ntu.edu.tw/handle/123456789/341035

Type

conference paper