Effect of UBM Thickness on the Mean Time to Failure of Flip-Chip Solder Joints under Electromigration

Resource

Journal of Electronic Materials 37 (1): 96-101

Journal

Journal of Electronic Materials

Journal Volume

37

Journal Issue

1

Pages

96-101

Date Issued

2008

Date

2008

Author(s)

Lin, Y.L.

Lai, Y.S.

Lin, Y.W.

Kao, C.R.

URI

Type

journal article

File(s)

Name

10.pdf

Size

368.8 KB

Format

Adobe PDF

Checksum

(MD5):8f179911abe11ca44f3d6f2a01ce2a71