A Study on the Growth Kinetics and Mechanical Properties of IMCs in Au-In Joints
Journal
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Part Of
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Start Page
99
End Page
100
Date Issued
2025-04-15
Author(s)
Chang, Chih-Chia Bill
Abstract
Au-In is one of the systems used in electronic packaging, including optoelectronics, TIM packaging, and low-temperature soldering. Despite its wide use, however, interfacial reactions in the temperature range of 156.6°C to 250°C remain insufficiently explored, and the mechanical properties of IMCs other than AuIn2 are rarely documented. This study examines the microstructural evolution of Au-In diffusion couples reacted between 165°C and 215°C, utilizing cold ion cross-sectioning, and evaluates IMCs' mechanical properties through indentation methods. The growth kinetics, fitted to a power law, as well as the hardness and reduced modulus of the IMCs, are reported.
Event(s)
24th International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2025, Nagano, 15 April 2025 through 19 April 2025. Code 209021
Subjects
growth kinetics
IMC
interfacial reaction
microindentation
nanoindentation
Publisher
IEEE
Type
conference paper