Transport Layer Assisted Routing for Non-Stationary Irregular mesh of thermal-aware 3D Network-on-Chip systems
Journal
International System on Chip Conference
Pages
284-289
Date Issued
2011
Author(s)
Abstract
Thermal issue is important for 3D Network-on-Chip systems. To ensure thermal safety, run-time thermal management is required. However, the regulation of temperature requires throttling of the near-overheated router, which makes the topology become Non-Stationary Irregular mesh (NSI-mesh). To successfully deliver packet in NSI-mesh, we propose the Transport Layer Assisted Routing (TLAR) scheme and two algorithms for thermal-aware 3D NoC. Based on the experimental results, the proposed routing scheme can reduce the latency over 57.5% and improve the throughput above 1.47×.
SDGs
Type
conference paper