Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managementse

Journal

IEEE Circuits and Systems Magazine

Journal Volume

15

Journal Issue

4

Pages

3126-3139

Date Issued

2015

Author(s)

Kun-Chih (Jimmy) Chen

Chih-Hao Chao

An-Yeu (Andy) Wu

DOI

URI

Type

journal article